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| FBI6A1M1.......FBI6M1M1 6 Amp. Glass Passivated Bridge Rectifier Dimensions in mm. 25 3.2 3.5 Plastic Case Voltage 50 to 1000 V. Current 6.0 A. (R) _ 1 + 0.05 + * Glass Passivated Junction Chips. L 7.5 7.5 10 suffix -4 1 0.7 * UL recognized under component index file number E130180. * Lead and polarity identifications. * * * * Case: Molded Plastic. Ideal for printed circuit board (P.C.B.). High surge current capability. The plastic material carries U/L recognition 94 V-O. 17.5 8 * Mounting Instructions * High temperature soldering guaranteed: 260 C - 10 sc. * Recommended mounting torque: 8 Kg.cm. Maximum Ratings, according to IEC publication No. 134 FBI6A FBI6B 1M1 1M1 FBI6D 1M1 200 140 FBI6G 1M1 400 280 FBI6J 1M1 600 420 FBI6K FBI6M 1M1 1M1 800 560 1000 700 VRRM VRMS IF(AV) IFSM I2t VDIS Tj Tstg Peak recurrent reverse voltage (V) Maximum RMS voltage (V) Max. Average forward current with heatsink without heatsink 10 ms. peak forward surge current (Jedec Method) Current squared time (rating for fusing) (1ms. 100 70 6.0 A at 100 C 3.0 A at 40 C 170 A 140 A sec 2000 V - 55 to + 150 C - 55 to +150 C 2 Electrical Characteristics at Tamb = 25C VF IR Rth (j-c) Rth (j-a) Max. forward voltage drop per diode at IF = 3.0 A Max. instantaneous reverse current at VRRM MAXIMUM THERMAL RESISTANCE Junction-Case. With Heatsink. Junction-Ambient. Without Heatsink. 1.05 V 5A 2.2 C/W 22 C/W Jan - 00 FBI6 - 1M1 Characteristic Curves TYPICAL FORWARD CHARACTERISTIC Tamb = 25 C FORWARD CURRENT DERATING CURVE 10 8 heatsink Tc Tc 6 1.0 on glass-epoxi substrate _ + sine wave R-load on heatsink 4 0.1 2 _ + P.C.B. soldering land 5 mm o sine wave R-load free in air 0 0.6 1.0 1.4 VF , instantaneous forward voltage (V) 0 0 25 50 75 100 125 150 175 Tamb, ambient temperature (C) MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT 200 150 100 50 0 1 10 Number of cycles at 50 Hz. 100 Jan - 00 |
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